Wafer-bonded 2-D CMUT arrays incorporating through-wafer trench-isolated interconnects with a supporting frame

IEEE Transactions on Ultrasonics, Ferroelectrics, and Frequency Control

Volumn 56, Issue 1, 2009, Pages 182-192

  Zhuang, Xuefeng ^a   Wygant, Ira O ^a   Lin, Der Song ^a   Kupnik, Mario ^a   Oralkan, Ömer ^a   Khuri Yakub, Butrus T ^a  

^a STANFORD UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

2-D ARRAYS; A CENTERS; AMPLITUDE DISTRIBUTIONS; ARRAY ELEMENTS; BULK SILICONS; CAPACITIVE MICROMACHINED ULTRASONIC TRANSDUCERS; CHIP BONDINGS; CONDUCTIVE SILICONS; DEVICE LAYERS; ELECTRICAL CONNECTIONS; ELECTRICAL INTERCONNECTS; FRACTIONAL BAND WIDTHS; FRAME STRUCTURES; MECHANICAL SUPPORTS; ON WAFERS; PULSE ECHOES; SILICON ON INSULATORS; SILICON PILLARS; SUPPORTING FRAMES; THROUGH-WAFER VIAS; TRANSDUCER SURFACES; TRENCH ISOLATIONS; ULTRASOUND IMAGING; VIA FABRICATIONS; VIABLE SOLUTIONS;

ELECTRIC CONNECTORS; ELECTROACOUSTIC TRANSDUCERS; FABRICATION; INTEGRATED CIRCUITS; SEMICONDUCTING SILICON COMPOUNDS; SILICON WAFERS; TRANSDUCERS; TWO DIMENSIONAL; ULTRASONIC APPLICATIONS; ULTRASONIC IMAGING; ULTRASONIC TRANSDUCERS; ULTRASONICS;

WAFER BONDING;

SILICON; SOYBEAN OIL;

AIR; ARTICLE; CHEMISTRY; ECHOGRAPHY; EQUIPMENT DESIGN; FOURIER ANALYSIS; IMAGE QUALITY; IMPEDANCE; INSTRUMENTATION; MICROELECTROMECHANICAL SYSTEM; TRANSDUCER;

AIR; ELECTRIC IMPEDANCE; EQUIPMENT DESIGN; FOURIER ANALYSIS; MICRO-ELECTRICAL-MECHANICAL SYSTEMS; PHANTOMS, IMAGING; SILICON; SOYBEAN OIL; TRANSDUCERS; ULTRASONOGRAPHY;

EID: 60349099308     PISSN: 08853010     EISSN: None     Source Type: Journal    
DOI: 10.1109/TUFFC.2009.1018     Document Type: Article

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