Finite element analysis of fabrication related thermal effects in capacitive micromachined ultrasonic transducers

Proceedings - IEEE Ultrasonics Symposium

Volumn 1, Issue , 2006, Pages 938-941

  Kupnik, Mario ^a   Ergun, Arif S ^a   Yaralioglu, Goksen G ^a   Bayram, Baris ^a   Oralkan, Ömer ^a   Wong, Serena H ^a   Lin, Dersong ^a   Khuri Yakub, Butrus T ^a  

^a STANFORD UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ACCURATE PREDICTION; CAPACITIVE MICROMACHINED ULTRASONIC TRANSDUCER; CELL LAYERS; COLLAPSE VOLTAGE; DEPOSITION TEMPERATURES; DEVICE DESIGN; DEVICE FABRICATIONS; DYNAMIC PERFORMANCE; FINITE ELEMENT ANALYSIS; MEMBRANE DEFLECTIONS; OPERATION POINT; STATIC DEFLECTIONS; STATIC SOLUTIONS; STRESS EFFECTS; STRUCTURAL INTERACTIONS; TEMPERATURE STRESS; UNKNOWN PARAMETERS;

FABRICATION; FINITE ELEMENT METHOD; METALLIZING; PLATES (STRUCTURAL COMPONENTS); THERMAL EXPANSION; TRANSDUCERS; ULTRASONIC EQUIPMENT; ULTRASONIC MEASUREMENT; ULTRASONIC WAVES; ULTRASONICS;

ULTRASONIC TRANSDUCERS;

EID: 78649356172     PISSN: 10510117     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ULTSYM.2006.254     Document Type: Conference Paper

References (6)

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5. G.G. Yaralioglu, A. S. Ergun, B. Bayram, T. Marentis, and B. T. Khuri-Yakub, "Residual Stress and Young's Modulus Measurement of Capacitive Micromachined Ultrasonic Transducer Membranes," in Proc. IEEE Ultrason. Symp., 2001, pp. 953-956
6. ANSYS 10.0 Manual, Ansys Inc., Canonsburg, PA.