Microfabricated ultrasonic transducers monolithically integrated with high voltage electronics

Proceedings - IEEE Ultrasonics Symposium

Volumn 1, Issue , 2004, Pages 493-496

  Daft, Chris ^a   Calmes, Sam ^a   Graca, Daniel Da ^a   Patel, Kirti ^a   Wagner, Paul ^a   Ladabaum, Igal ^a  

^a Sensant Corp   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ACOUSTIC PROPERTIES; CORRELATION METHODS; ELECTRIC POTENTIAL; ELECTRONIC EQUIPMENT; HYDROPHONES; MATRIX ALGEBRA; MEDICAL IMAGING; MONOLITHIC INTEGRATED CIRCUITS; MULTIPLEXING; SILICON WAFERS; SWITCHING FUNCTIONS;

ACOUSTIC ELEMENTS; HIGH VOLTAGE ELECTRONICS; MONOLITHIC INTEGRATION; SIGNAL INTEGRITY;

ULTRASONIC TRANSDUCERS;

EID: 21644470582     PISSN: 10510117     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (5)

1. P-C. Eccardt et al., "Surface micromachined ultrasound transducers in CMOS technology," Proc. 1996 IEEE Ultrasonics Symposium, 959-962.
2. R.A. Noble et al. "Low-Temperature Micro-machined cMUTs with Fully-Integrated Analogue Front-End Electronics," Proc. 2002 IEEE Ultrasonics Symposium. 1045-1049.
3. D.G. Wildes et al., "Elevation Performance of 1.25D and 1.5D Transducer Arrays," IEEE Trans. UFFC 44(5), 1027-1037, 1997.
4. O. Oralkan et al., "Volumetric ultrasound imaging using 2-D CMUT arrays," IEEE Trans. UFFC 50(11), 1581-94, 2003.
5. G.S. Kino, "Acoustic Waves," 179-180. Englewood Cliffs. NJ: Prentice-Hall 1987.