Packaging and design of reconfigurable arrays for volumetric imaging

Proceedings - IEEE Ultrasonics Symposium

Volumn , Issue , 2007, Pages 407-410

  Fisher, R ^a   Wodnicki, R ^a   Cogan, S ^a   Thomas, R ^a   Mills, D ^a   Woychik, C ^a   Lewandowski, R ^a   Thomenius, K ^a  

^a GE GLOBAL RESEARCH   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ACOUSTIC TRANSDUCERS; ACOUSTIC WAVES; ANTENNA PHASED ARRAYS; ELECTRONICS INDUSTRY; IMAGE QUALITY; INTEGRATED CIRCUITS; NONMETALS; OPTICAL DESIGN; SILICON; THREE DIMENSIONAL; TRANSDUCERS; TWO DIMENSIONAL; ULTRASONIC IMAGING; ULTRASONIC TRANSDUCERS; ULTRASONICS;

2-D ARRAY; ANNULAR ARRAYS; ARRAY ELEMENTS; AXISYMMETRIC FOCUSING; CAPACITIVE MICROMACHINED ULTRASOUND TRANSDUCERS; CHANNEL COUNT; HIGH-DENSITY; HIGHLY INTEGRATED; KEY COMPONENTS; MINIATURIZED SYSTEMS; MULTI LAYERING; PHASED ARRAYS; PIEZO CERAMICS; POWER CONSUMPTION; RE CONFIGURABILITY; RE-CONFIGURABLE; RECONFIGURABLE ARRAYS; STACK DESIGN; SWITCH MATRICES; SYSTEM SIZES; THROUGH-SILICON VIAS; TRANSDUCER ARRAYS; ULTRASOUND ARRAYS; VOLUMETRIC IMAGING;

APPLICATION SPECIFIC INTEGRATED CIRCUITS;

EID: 48149096018     PISSN: 10510117     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ULTSYM.2007.111     Document Type: Conference Paper

References (8)

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