Characterization of fabrication related gap-height variations in capacitive micromachined ultrasonic transducers

Proceedings - IEEE Ultrasonics Symposium

Volumn , Issue , 2007, Pages 523-526

  Lin, Der Song ^a   Zhuang, Xuefeng ^a   Wong, Serena H ^a   Ergun, Arif S ^b   Kupnik, Mario ^a   Khuri Yakub, Butrus T ^a  

^a STANFORD UNIVERSITY   (United States)

^b SIEMENS CORPORATE RESEARCH   (United States)

Author keywords

Bottom electrode; CMUT; Doped polysilicon; Gap height; In cavity deposition; Sealing; Surface roughness

Indexed keywords

ATOMIC FORCE MICROSCOPY; ELECTROACOUSTIC TRANSDUCERS; FRICTION; GALLIUM ALLOYS; IMAGING TECHNIQUES; NONMETALS; OPTICAL DESIGN; PHOTORESISTS; POLYSILICON; SILICON; SURFACE PROPERTIES; SURFACE ROUGHNESS; SURFACE TOPOGRAPHY; ULTRASONICS;

AFM MEASUREMENTS; BOTTOM ELECTRODE; BOTTOM ELECTRODES; BULK SILICON; CAPACITIVE MICROMACHINED ULTRASONIC TRANSDUCERS; CMUT; COLLAPSE VOLTAGE; DOPED POLYSILICON; FABRICATION PROCESSES; GAP-HEIGHT; IN-CAVITY DEPOSITION; OPERATION POINTS; POLY SILICON FILMS; POLYSILICON LAYERS; PULL-IN; RELEASE PROCESS; SEALING;

ULTRASONIC TRANSDUCERS;

EID: 48149096016     PISSN: 10510117     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ULTSYM.2007.138     Document Type: Conference Paper

References (4)

1. M. Kupnik, et al., 'Finite Element Analysis of Fabrication Related Thermal Effects in CMUTs', in Proc. IEEE Ultrason. Symp., 2006, pp. 938-941.
2. M. Madou, Fundamentals of Microfabrication, 2nd ed. New York: CRC, 2001, pp. 293-299.
3. V. Senez, et al., J. Appl. Phys., 76, 3285, 1994.
4. Greenwood J A, et al., 'Contact of nominally flat surfaces', Proc. R. Soc. Lond. A 295, 1966, pp. 300-319.