An efficient electrical addressing method using through-wafer vias for two-dimensional ultrasonic arrays

Proceedings of the IEEE Ultrasonics Symposium

Volumn 2, Issue , 2000, Pages 1179-1182

  Cheng, Ching H ^a   Chow, Eugene M ^a   Jin, Xuecheng ^a   Ergun, Sanli ^a   Khuri Yakub, Butrus T ^a  

^a STANFORD UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ACOUSTIC ARRAYS; ACTUATORS; ASPECT RATIO; CAPACITANCE; FLIP CHIP DEVICES; MIS DEVICES; PRINTED CIRCUIT BOARDS; REACTIVE ION ETCHING; SENSORS; WSI CIRCUITS;

CAPACITIVE MICROMACHINED ULTRASONIC TRANSDUCERS (CMUT);

ULTRASONIC TRANSDUCERS;

EID: 0034579981     PISSN: 10510117     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (6)

1. Silicon micromachined ultrasonic transducers
2. Highly integrated 2-D capacitive micromachined ultrasound transducers
3. Recent progress in capacitive micromachined ultrasonic immersion transducer array
4. Ultra-low resistance, through-wafer via (TWV) technology and its application in three dimensional structures on silicon
5. Forming electrical interconnections through semiconductor wafers
6. Through-wafer electrical interconnects compatible with stanford semiconductor processing