Process compatible polysilicon-based electrical through-wafer interconnects in silicon substrates

Journal of Microelectromechanical Systems

Volumn 11, Issue 6, 2002, Pages 631-640

  Chow, Eugene M ^a   Chandrasekaran, Venkataraman ^b   Partridge, Aaron ^a   Nishida, Toshikazu ^b   Sheplak, Mark ^b   Quate, Calvin F ^a   Kenny, Thomas W ^a  

^a STANFORD UNIVERSITY   (United States)

^b UNIVERSITY OF FLORIDA   (United States)

Author keywords

Electrical through wafer interconnects (ETWI); MEMS and IC integration; Through wafer via deep silicon plasma etch

Indexed keywords

ETCHING; HIGH TEMPERATURE APPLICATIONS; INTEGRATED CIRCUITS; MICROELECTROMECHANICAL DEVICES; SENSORS; SUBSTRATES;

ELECTRICAL THROUGH-WAFER INTERCONNECTS (ETWI);

POLYSILICON;

EID: 0036904516     PISSN: 10577157     EISSN: None     Source Type: Journal    
DOI: 10.1109/JMEMS.2002.805206     Document Type: Article

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