A cost-effective and manufacturable route to the fabrication of high-density 2D micromachined ultrasonic transducer arrays and (CMOS) signal conditioning electronics on the same silicon substrate

Proceedings of the IEEE Ultrasonics Symposium

Volumn 2, Issue , 2001, Pages 941-944

  Noble, R A ^a   Davies, R R ^a   Day, M M ^a   Koker, L ^a   King, D O ^a   Brunson, K M ^a   Jones, A R D ^a   Intosh, J S M ^a   Hutchins, D A ^a   Robertson, T J ^a   Saul, P ^a  

^a QINETIQ   (United Kingdom)

Author keywords

[No Author keywords available]

Indexed keywords

ARRAYS; CMOS INTEGRATED CIRCUITS; COSTS; FABRICATION; MICROMACHINING; SEMICONDUCTING SILICON; SUBSTRATES; TWO DIMENSIONAL;

MICROMACHINED ULTRASONIC TRANSDUCER ARRAY; SIGNAL CONDITIONING ELECTRONICS;

ULTRASONIC TRANSDUCERS;

EID: 0035731025     PISSN: 10510117     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (3)

1. An efficient electrical addressing method using through-wafer vias for two-dimensional ultrasonic arrays
2. Surface micromachined ultrasound transducers in CMOS technology
3. Novel silicon nitride micromachined wide bandwidth ultrasonic transducers