Fabrication of flexible transducer arrays with through-wafer electrical interconnects based on trench refilling with PDMS

Journal of Microelectromechanical Systems

Volumn 17, Issue 2, 2008, Pages 446-452

  Zhuang, Xuefeng ^a   Lin, Der Song ^a   Oralkan, Ömer ^a   Khuri Yakub, Butrus T ^a  

^a STANFORD UNIVERSITY   (United States)

Author keywords

Capacitive micromachined ultrasonic transducer (CMUT); Fabrication; Flexible arrays; Intravascular ultrasound (IVUS); Polydimethylsiloxane (PDMS); Through wafer interconnects; Trench isolation

Indexed keywords

CAPACITIVE MICROMACHINED ULTRASONIC TRANSDUCER (CMUT); FLEXIBLE ARRAYS; INTRAVASCULAR ULTRASOUND (IVUS); POLYDIMETHYLSILOXANE (PDMS); THROUGH-WAFER INTERCONNECTS; TRENCH ISOLATION;

CATHETERS; ELECTROACOUSTIC TRANSDUCERS; FABRICATION; MICROCHANNELS; NATURAL FREQUENCIES; NONMETALS; PIEZOELECTRIC TRANSDUCERS; REACTIVE ION ETCHING; SEMICONDUCTING SILICON COMPOUNDS; SILICONES; SUBSTRATES; ULTRASONIC EQUIPMENT; ULTRASONIC IMAGING; ULTRASONIC MEASUREMENT; ULTRASONIC TESTING; ULTRASONIC TRANSDUCERS; ULTRASONIC WAVES; ULTRASONICS;

SILICON WAFERS;

EID: 60349090548     PISSN: 10577157     EISSN: None     Source Type: Journal    
DOI: 10.1109/JMEMS.2008.918381     Document Type: Article

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