Low-temperature micromachined cMUTs with fully-integrated analogue front-end electronics

Proceedings of the IEEE Ultrasonics Symposium

Volumn 2, Issue , 2002, Pages 1045-1050

  Noble, R A ^a   Davies, R R ^a   King, D O ^a   Day, M M ^a   Jones, A R D ^a   McIntosh, J S ^b   Hutchins, D A ^b   Saul, P ^c  

^a QINETIQ   (United Kingdom)

^b UNIVERSITY OF WARWICK   (United Kingdom)

^c Saul Research   (United Kingdom)

Author keywords

[No Author keywords available]

Indexed keywords

AMPLIFIERS (ELECTRONIC); CAPACITANCE; INTEGRATED CIRCUIT LAYOUT; INTEGRATED CIRCUITS; MICROMACHINING; PLASMA ENHANCED CHEMICAL VAPOR DEPOSITION; SCANNING ELECTRON MICROSCOPY; SEMICONDUCTING SILICON; SIGNAL TO NOISE RATIO; SILICON NITRIDE; SUBSTRATES;

ANALOG FRONT-END ELECTRONICS; CAPACITIVE MICROMACHINED ULTRASONIC TRANSDUCER; LOW-TEMPERATURE MICROMACHINING;

ULTRASONIC TRANSDUCERS;

EID: 0036989220     PISSN: 10510117     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (6)

1. R.A. Noble et al, "A cost-effective & manufacturable route to the fabrication of high-density 2D cMUT arrays & signal conditioning electronics on the same silicon substrate", Proc. IEEE, Ultras. Sym, Vol. 2, pp. 941-944, 2001.
2. C.H. Cheng, E.H. Chow, X. Jin, S. Ergun, B.T. Khuri-Yakub, "An efficient electrical addressing method using through-wafer vias for 2D ultrasonic arrays", Proc. IEEE, Ultras. Sym, Vol. 2, pp. 1179-1182, 2000.
3. P.C. Eccardt, K. Niederer, T. Scheiter, C. Hierold, "Surface micromachined ultrasound transducers in CMOS technology" Proc. IEEE, Ultras. Sym, pp. 959-962, 1996.
4. R.A.Noble et al "Novel, Wide Bandwidth Micromachined Ultrasonic Transducers", IEEE Trans Ultras. Ferr. Freq Cont., pp. 1495-1507, Nov. 2001.
5. W.P.Mason, "Electromechanical Transducers and Wave Filters", 2nd Ed, Van Nostrand, 1948.
6. R.R.Davies et al, "Engineering In- and Out-of-Plane Stress in PECVD Silicon Nitride for CMOS-Compatible Surface Micromachining", SPIE Micromachining and Microfabrication, Vol 4557, pp.320-328, Oct. 2001.