Integration of trench-isolated through-wafer interconnects with 2d capacitive micromachined ultrasonic transducer arrays

Sensors and Actuators, A: Physical

Volumn 138, Issue 1, 2007, Pages 221-229

  Zhuang, Xuefeng ^a   Ergun, Arif S ^b   Huang, Yongli ^c   Wygant, Ira O ^a   Oralkan, Omer ^a   Khuri Yakub, Butrus T ^a  

^a STANFORD UNIVERSITY   (United States)

^b SIEMENS CORPORATE RESEARCH   (United States)

^c Kolo Technologies Inc   (United States)

Author keywords

Capacitive micromachined ultrasonic transducer (CMUT); Flip chip bonding; Post processing; Through wafer interconnect; Trench isolation

Indexed keywords

FLIP CHIP DEVICES; INTEGRATED CIRCUITS; MICROMACHINING; REACTIVE ION ETCHING; SILICON WAFERS;

CAPACITIVE MICROMACHINED ULTRASONIC TRANSDUCER (CMUT); FLIP-CHIP BONDING; POST-PROCESSING; THROUGH-WAFER INTERCONNECTS; TRENCH ISOLATION;

ULTRASONIC TRANSDUCERS;

EID: 34347216702     PISSN: 09244247     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.sna.2007.04.008     Document Type: Article

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