Quantitative characterizations of a nanopatterned bonded wafer: Force determination for nanoimprint lithography stamp removal

Nanotechnology

Volumn 19, Issue 12, 2008, Pages

  Landis, S ^a   Chaix, N ^a   Gourgon, C ^a   Leveder, T ^a  

^a CEA LETI   (France)

Author keywords

[No Author keywords available]

Indexed keywords

CHARACTERIZATION; NANOIMPRINT LITHOGRAPHY; PLASTIC MOLDS; SEMICONDUCTOR DEVICE MODELS;

DEMOLDING PROCESS; NANOPATTERNED BONDED WAFERS; NANOSCALE FEATURES; POLYMER FLOW;

SILICON WAFERS;

NANOPARTICLE; POLYMER;

ADHESION; ARTICLE; CHEMICAL BOND; CHEMICAL STRUCTURE; FRICTION; PRIORITY JOURNAL; QUANTITATIVE ANALYSIS;

COMPUTER CHIPS; LITHOGRAPHY; MODELS; MOLDS; SEMICONDUCTOR DEVICES;

EID: 42549084800     PISSN: 09574484     EISSN: 13616528     Source Type: Journal    
DOI: 10.1088/0957-4484/19/12/125305     Document Type: Article

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