Mechanics of thin films and microdevices

IEEE Transactions on Device and Materials Reliability

Volumn 4, Issue 2, 2004, Pages 176-188

  Chasiotis, Ioannis ^a  

^a University of Virginia   (United States)

Author keywords

Fracture toughness; Microelectromechanical systems (MEMS); Nanomechanical measurements; Poisson's ratio; Young's modulus

Indexed keywords

ATOMIC FORCE MICROSCOPY; ELASTIC MODULI; ELASTICITY; FRACTURE TOUGHNESS; MATHEMATICAL MODELS; MICROELECTROMECHANICAL DEVICES; OPTICAL RESOLVING POWER; POISSON RATIO; PROBLEM SOLVING; RANDOM PROCESSES; STRAIN RATE;

DIGITAL IMAGE CORRELATION (DIC); INTERFACE RELIABILITY; NANOMECHANICAL MEASUREMENTS;

THIN FILMS;

EID: 4043149341     PISSN: 15304388     EISSN: None     Source Type: Journal    
DOI: 10.1109/TDMR.2004.829901     Document Type: Article

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