The fracture toughness of polysilicon microdevices: A first report

Journal of Materials Research

Volumn 12, Issue 4, 1997, Pages 915-922

  Ballarini, R ^a   Mullen, R L ^a   Yin, Y ^a   Kahn, H ^a   Stemmer, S ^a   Heuer, A H ^a  

^a Case Western Reserve University   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CRACK INITIATION; CRITICAL CURRENT DENSITY (SUPERCONDUCTIVITY); FRACTURE TOUGHNESS; MICROMACHINING; SILICONES;

POLYSILICON MICRODEVICES;

MICROELECTROMECHANICAL DEVICES;

EID: 0031125510     PISSN: 08842914     EISSN: None     Source Type: Journal    
DOI: 10.1557/JMR.1997.0131     Document Type: Article

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