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Volumn 795, Issue , 2003, Pages 527-532
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Thin film material parameters derived from full field nanometric displacement measurements in non-uniform MEMS geometries
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Author keywords
[No Author keywords available]
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Indexed keywords
ADHESION;
ATOMIC FORCE MICROSCOPY;
DEFORMATION;
ELASTIC MODULI;
INVERSE PROBLEMS;
LEAST SQUARES APPROXIMATIONS;
POISSON RATIO;
STRAIN;
STRESS ANALYSIS;
TENSILE STRESS;
THIN FILMS;
DIGITAL IMAGE CORRELATION (DIC);
LOAD LEVELS;
NONLINEAR LEAST SQUARE ANALYSIS;
TENSILE STRAIN;
MICROELECTROMECHANICAL DEVICES;
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EID: 2442625494
PISSN: 02729172
EISSN: None
Source Type: Conference Proceeding
DOI: 10.1557/proc-795-u11.28 Document Type: Conference Paper |
Times cited : (3)
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References (19)
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