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Volumn 795, Issue , 2003, Pages 527-532

Thin film material parameters derived from full field nanometric displacement measurements in non-uniform MEMS geometries

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION; ATOMIC FORCE MICROSCOPY; DEFORMATION; ELASTIC MODULI; INVERSE PROBLEMS; LEAST SQUARES APPROXIMATIONS; POISSON RATIO; STRAIN; STRESS ANALYSIS; TENSILE STRESS; THIN FILMS;

EID: 2442625494     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1557/proc-795-u11.28     Document Type: Conference Paper
Times cited : (3)

References (19)
  • 3
    • 0004229184 scopus 로고    scopus 로고
    • ASTM, West Conshohocken, PA
    • A.S.T.M., ASTM Standard E111-98, (ASTM, West Conshohocken, PA, 1998).
    • (1998) ASTM Standard , vol.E111-98
  • 4
    • 0004229184 scopus 로고    scopus 로고
    • ASTM, West Conshohocken, PA
    • A.S.T.M., ASTM Standard E132-97, (ASTM, West Conshohocken, PA, 1998).
    • (1998) ASTM Standard , vol.E132-97


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.