A new microtensile tester for the study of MEMS materials with the aid of atomic force microscopy

Experimental Mechanics

Volumn 42, Issue 1, 2002, Pages 51-57

  Chasiotis, Ioannis ^a   Knauss, Wolfgang G ^b  

^a University of Virginia   (United States)

^b CALIFORNIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

AFM; Digital image correlation; Mechanical properties; MEMS; Microtensile testing

Indexed keywords

ATOMIC FORCE MICROSCOPY; ELASTIC MODULI; ELECTROSTATICS; MICROMACHINING; TENSILE STRENGTH; ULTRAVIOLET RADIATION;

DIGITAL IMAGE CORRELATION (DIC);

POLYSILICON;

ATOMIC FORCE MICROSCOPY; MICROELECTROMECHANICAL SYSTEM; TEST APPARATUS;

EID: 0036504397     PISSN: 00144851     EISSN: None     Source Type: Journal    
DOI: 10.1177/0018512002042001789     Document Type: Article

References (14)

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4. In situ tensile strength measurement and weibull analysis of thick film and thin film micromachined polysilicon structures
5. Microtensile testing of free-standing polysilicon fibers of various grain sizes
6. Tensile testing of polycrystalline silicon thin films using electrostatic force grip
7. Variations in young's modulus and intrinsic stress of LPCVD polysilicon due to high-temperature annealing
8. Error limitations in the determination of mechanical properties of thin films
9. Submicron deformation field measurements II: Improved digital image correlation
10. Determination of displacements using an improved digital image correlation method
11. The elastic behavior of a crystalline aggregate
12. Berechnung der Fliessgrenze von Mischkristallen auf Grund der Plastizitaettsbediengung fuer EinKristalle
13. Calculated elastic constants for stress problems associated with semiconductor devices