Modeling the effects of abrasive size, surface oxidizer concentration and binding energy on chemical mechanical polishing at molecular scale

Tribology International

Volumn 41, Issue 3, 2008, Pages 202-210

  Wang, Yongguang ^a   Zhao, Yongwu ^a   Li, Xufang ^a  

^a JIANGNAN UNIVERSITY   (China)

Author keywords

Chemical mechanical polishing (CMP); Modeling; Molecular

Indexed keywords

BINDING ENERGY; MATHEMATICAL MODELS; PARTICLE SIZE; PROBABILITY; STATISTICAL METHODS; SURFACE CHEMISTRY;

MICRO CONTACT MECHANICS; MOLECULAR SCALES; SURFACE OXIDIZER CONCENTRATIONS; WAFER RELATIVE VELOCITY;

CHEMICAL MECHANICAL POLISHING;

EID: 35648997001     PISSN: 0301679X     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.triboint.2007.08.004     Document Type: Article

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