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Volumn 4, Issue 2, 2001, Pages

Chemical mechanical polishing of copper and tantalum in potassium iodate-based slurries

Author keywords

[No Author keywords available]

Indexed keywords

ABRASIVES; CHEMICAL MECHANICAL POLISHING; DISSOLUTION; ELECTROCHEMICAL ELECTRODES; ELECTROCHEMISTRY; PASSIVATION; PH EFFECTS; POLARIZATION; POTASSIUM COMPOUNDS; SILICA; SLURRIES; TANTALUM;

EID: 0035262729     PISSN: 10990062     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.1342185     Document Type: Article
Times cited : (52)

References (19)
  • 3
    • 0010413526 scopus 로고    scopus 로고
    • Ph.D. Thesis, Clarkson University, Potsdam, NY
    • (2000)
    • Ramarajan, S.1


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.