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Volumn 4, Issue 2, 2001, Pages
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Chemical mechanical polishing of copper and tantalum in potassium iodate-based slurries
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Author keywords
[No Author keywords available]
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Indexed keywords
ABRASIVES;
CHEMICAL MECHANICAL POLISHING;
DISSOLUTION;
ELECTROCHEMICAL ELECTRODES;
ELECTROCHEMISTRY;
PASSIVATION;
PH EFFECTS;
POLARIZATION;
POTASSIUM COMPOUNDS;
SILICA;
SLURRIES;
TANTALUM;
POTASSIUM IODATE;
POTENTIODYNAMIC POLARIZATION;
ROTATING DISK ELECTRODE;
COPPER;
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EID: 0035262729
PISSN: 10990062
EISSN: None
Source Type: Journal
DOI: 10.1149/1.1342185 Document Type: Article |
Times cited : (52)
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References (19)
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