Effect of particle size during tungsten chemical mechanical polishing

Electrochemical and Solid-State Letters

Volumn 2, Issue 8, 1999, Pages 401-403

  Bielmann, M ^a   Mahajan, U ^a   Singh, R K ^a  

^a University of Florida   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ABRASIVES; ALUMINA; CHEMICAL VAPOR DEPOSITION; PARTICLE SIZE ANALYSIS; SURFACE ROUGHNESS; TUNGSTEN;

CHEMICAL MECHANICAL POLISHING (CMP);

CHEMICAL POLISHING;

EID: 0032674817     PISSN: 10990062     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.1390851     Document Type: Article

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