Recent progress in study on material removal mechanisms of silicon wafer during chemical mechanical polishing

Mocaxue Xuebao/Tribology

Volumn 24, Issue 3, 2004, Pages 283-287

  Zhao, Yong Wu ^a   Liu, Jia Jun ^b  

^a JIANGNAN UNIVERSITY   (China)

^b TSINGHUA UNIVERSITY   (China)

Author keywords

Chemical mechanical polishing; Chemical mechanical synergistic effect; Material removal mechanisms; Silicon wafer

Indexed keywords

CHEMISTRY; EFFECTS; EFFICIENCY; MECHANICS; SILICON WAFERS;

CHEMICAL MECHANICAL SYNERGISTIC EFFECT; MATERIAL REMOVAL MECHANISMS; RECENT PROGRESS;

CHEMICAL MECHANICAL POLISHING;

EID: 4744346695     PISSN: 10040595     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

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