A chemical kinetics model to explain the abrasive size effect on chemical mechanical polishing

Thin Solid Films

Volumn 476, Issue 1, 2005, Pages 130-136

  Hsun Chen, Ping ^a,b   Wei Huang, Bing ^a   Shih, Han C ^a  

^a CMS ITRI   (Taiwan)

^b NONE   (Taiwan)

Author keywords

Oxides; Planarization; Polymers

Indexed keywords

CATALYSTS; CHEMICAL MECHANICAL POLISHING; PARAMETER ESTIMATION; PARTICLE SIZE ANALYSIS; REACTION KINETICS; STIFFNESS;

ABRASIVE SIZE EFFECT; PAD-PARTICLE INTERFACES; PLANARIZATION; WAFER SURFACES;

ABRASIVES;

EID: 13844254361     PISSN: 00406090     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.tsf.2004.09.049     Document Type: Article

References (16)

1. X.W. Lin, and D. Pramanik Solid State Technology 41 1998 63
2. J.W. Hsu, S.Y. Chiu, M.S. Tsai, B.T. Dai, M.S. Feng, and H.C. Shih J. Vac. Sci. Technol., B 20 2002 608
3. L.M. Cook J. Non-Cryst. Solids 120 1990 152
4. E. Paul J. Electrochem. Soc. 148 2001 G355
5. D.G. Thakurta, D.W. Schwendeman, R.J. Gutmann, S. Shankar, L. Jiang, and W.N. Gill Thin Solid Films 414 2002 78
6. R.J. Gutmann, D.J. Duquette, P.S. Dutta, and W.N. Gill Proceedings of 6th International Chemical-Mechanical Planarization for ULSI Multilevel Interconnect Conference (2001 CMP-MIC), Santa Clara, U.S.A., March 7-9 2001 81
7. J.F. Luo, and D.A. Dornfeld IEEE Trans. Semicond. Manuf. 14 2001 112
8. G. Fu, A. Chandra, S. Guha, and G. Subhash IEEE Trans. Semicond. Manuf. 14 2001 406
9. P.H. Chen, H.C. Han, B.W. Huang, and J.W. Hsu Electrochem. Solid-State Lett. 6 2003 G140
10. R. Jairath, M. Desai, M. Stell, R. Telles, and D. Scherber-Brewer S.P. Murarka A. Katz K.N. Tu K. Maex Advanced Metallization for Devices and Circuits-Science, Technology and Manufacturability, San Francisco, CA, U.S.A, April 4-8, 1994 Materials Research Society Symposium Proceedings vol. 337 1994 121
11. J. Hernandez, P. Wrschka, Y. Hsu, T.S. Kuan, G.S. Oehrlein, H.J. Sun, D.A. Hansen, J. King, and M.A. Fury J. Electrochem. Soc. 146 1999 4647
12. H.S. Fogler Elements of Chemical Reaction Engineering 2nd ed. 1992 Prentice Hall P T R USA
13. A. Philipossian, and E. Mitchell MICRO 20 2002 85
14. J. McGrath, C. Davis, and J. McGrath J. Mater. Process. Technol. 132 2003 16
15. M. Bielmann, U. Mahajan, and R.K. Singh Electrochem. Solid-State Lett. 2 1999 401
16. J.M. Steigerwald, S.P. Murarka, and R.J. Gutmann Chemical Mechanical Planarization of Microelectronic Materials 1997 John Wiley and Sons New York, USA