A scratch intersection model of material removal during Chemical Mechanical Planarization (CMP)

Journal of Manufacturing Science and Engineering

Volumn 127, Issue 3, 2005, Pages 545-554

  Che, Wei ^a   Guo, Yongjin ^a   Chandra, Abhijit ^a   Bastawros, Ashraf ^a  

^a Iowa State University   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

DEFORMATION; DUCTILITY; FORCE MEASUREMENT; PARTICLE SIZE ANALYSIS; SCANNING ELECTRON MICROSCOPY;

CHEMICAL MECHANICAL PLANARIZATION (CMP); DUCTILE METALS; ISOLATE SHALLOW SCRATCH; MATERIAL REMOVAL RATE (MRR);

MATERIALS SCIENCE;

EID: 24744466890     PISSN: 10871357     EISSN: None     Source Type: Journal    
DOI: 10.1115/1.1949616     Document Type: Article

References (18)

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