Impact of Abrasive Particles on the Material Removal Rate in CMP: A Microcontact Perspective

Electrochemical and Solid-State Letters

Volumn 7, Issue 2, 2004, Pages

  Jeng, Yeau Ren ^a   Huang, Pay Yau ^a  

^a NATIONAL CHUNG CHENG UNIVERSITY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

ABRASIVES; DATA REDUCTION; INTERFACES (MATERIALS); PARAMETER ESTIMATION; PARTICLE SIZE ANALYSIS; REMOVAL; WEAR OF MATERIALS;

ABRASIVE PARTICLES; MATERIAL REMOVAL RATE;

CHEMICAL MECHANICAL POLISHING;

EID: 1642632726     PISSN: 10990062     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.1637561     Document Type: Article

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