Modeling the effects of cohesive energy for single particle on the material removal in chemical mechanical polishing at atomic scale

Applied Surface Science

Volumn 253, Issue 23, 2007, Pages 9137-9141

  Wang, Yongguang ^a   Zhao, Yongwu ^a   An, Wei ^a   Wang, Jun ^a  

^a JIANGNAN UNIVERSITY   (China)

Author keywords

Atomic scale; Binding energy; Chemical mechanical polishing; Modeling

Indexed keywords

BINDING ENERGY; COMPUTER SIMULATION; INTERFACES (MATERIALS); MATHEMATICAL MODELS; OXIDATION; PARTICLE SIZE;

COHESIVE ENERGY; REMOVAL RATE;

CHEMICAL MECHANICAL POLISHING;

EID: 34548292125     PISSN: 01694332     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.apsusc.2007.05.043     Document Type: Article

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