Study on the material removal mechanism in chemical mechanical polishing at the molecular scale

Pan Tao Ti Hsueh Pao/Chinese Journal of Semiconductors

Volumn 28, Issue 2, 2007, Pages 308-312

  Wang, Yongguang ^a   Zhao, Yongwu ^a  

^a JIANGNAN UNIVERSITY   (China)

Author keywords

Chemical mechanical polishing; Molecular scale mechanism experiment; Theoretical model

Indexed keywords

ATOMIC FORCE MICROSCOPY; CALCULATIONS; LINEAR REGRESSION; SPECTROSCOPIC ELLIPSOMETRY;

MATERIAL REMOVAL; MOLECULAR SCALE MECHANISM EXPERIMENT; THEORETICAL MODEL;

CHEMICAL MECHANICAL POLISHING;

EID: 34047241123     PISSN: 02534177     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

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