Polishing Pad Surface Morphology and Chemical Mechanical Planarization

Journal of the Electrochemical Society

Volumn 151, Issue 4, 2004, Pages

  Castillo Mejia, D ^a,b   Kelchner, J ^a,c   Beaudoin, S ^a,c  

^a Arizona State University   (United States)

^b INTEL CORPORATION   (United States)

^c PURDUE UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ELASTIC MODULI; ETCHING; FRICTION; LUBRICATION; MATHEMATICAL MODELS; MICROELECTRONICS; PLASTIC DEFORMATION; POISSON RATIO; PRESS LOAD CONTROL; SILICA; STRAIN; STRESS ANALYSIS; TOPOLOGY; WATER;

CHEMICAL MECHANICAL PLANARIZATION (CMP); DUAL-AXIS POLISHER; MICROCONTACT; POLISHING PAD SURFACE;

CHEMICAL MECHANICAL POLISHING;

EID: 2042436424     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.1649751     Document Type: Article

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