Analysis of the tribological mechanisms arising in the chemical mechanical polishing of copper-film wafers

Journal of Tribology

Volumn 126, Issue 1, 2004, Pages 185-199

  Lin, Jen Fin ^a   Chern, Junne Dar ^a   Chang, Yang Hui ^a   Kuo, Ping Lin ^b   Tsai, Ming Shih ^b  

^a NATIONAL CHENG KUNG UNIVERSITY   (Taiwan)

^b NATIONAL NANO DEVICE LABORATORIES   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

CHEMICAL MECHANICAL POLISHING; COPPER; FRICTION; LUBRICATION; PASSIVATION; PLASTIC DEFORMATION; REYNOLDS NUMBER; SILICON WAFERS;

ABRASIVE PARTICLES; CYLINDRICAL COORDINATE SYSTEMS;

TRIBOLOGY;

ADHESIVE WEAR; COPPER; ELASTIC DEFORMATION; FILM LUBRICANT; MATHEMATICAL MODELING; MIXED LUBRICATION; REYNOLDS EQUATION; TRIBOLOGY;

EID: 1342330064     PISSN: 07424787     EISSN: 15288897     Source Type: Journal    
DOI: 10.1115/1.1631010     Document Type: Article

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