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Volumn 44, Issue 12, 2005, Pages 8383-8390

Roles of colloidal silicon dioxide particles in chemical mechanical polishing of dielectric silicon dioxide

Author keywords

Chemical mechanical polishing; Colloidal silica particles; Friction force

Indexed keywords

CHEMICAL MECHANICAL POLISHING; DIELECTRIC MATERIALS; INTERFACES (MATERIALS); MATHEMATICAL MODELS; SILICON WAFERS; SLURRIES;

COLLOIDAL SILICA PARTICLES; FRICTION FORCES; POLISHING RATES; SOLID LOADINGS;

SILICA;

EID: 31544465238 PISSN: 00214922 EISSN: 13474065 Source Type: Journal
DOI: 10.1143/JJAP.44.8383 Document Type: Article

Times cited : (18)

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