A material removal rate model considering interfacial micro-contact wear behavior for chemical mechanical polishing

Journal of Tribology

Volumn 127, Issue 1, 2005, Pages 190-197

  Jeng, Yeau Ren ^a   Huang, Pay Yau ^a  

^a NATIONAL CHUNG CHENG UNIVERSITY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

ABRASIVES; CHEMICAL MECHANICAL POLISHING; CHEMICALS REMOVAL (WATER TREATMENT); MATHEMATICAL MODELS; PARTICLE SIZE ANALYSIS; PLANERS; SLURRIES;

ABRASIVE PARTICLES; MATERIAL REMOVAL MECHANISMS; PRESTON EQUATION;

WEAR OF MATERIALS;

SURFACE CONTACT;

EID: 15044360806     PISSN: 07424787     EISSN: None     Source Type: Journal    
DOI: 10.1115/1.1828068     Document Type: Article

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