On the CMP material removal at the molecular scale

Journal of Tribology

Volumn 129, Issue 2, 2007, Pages 436-437

  Chang, L ^a  

^a The Pennsylvania State University   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

DEBONDING; MOLECULES; REMOVAL; WAFER BONDING;

MATERIAL REMOVAL; ORDER-OF-MAGNITUDE CALCULATION; PLANARIZATION; SEMICONDUCTOR WAFERS;

CHEMICAL MECHANICAL POLISHING;

CHEMICAL MECHANICAL POLISHING; DEBONDING; MOLECULES; REMOVAL; WAFER BONDING;

EID: 34249002660     PISSN: 07424787     EISSN: None     Source Type: Journal    
DOI: 10.1115/1.2647829     Document Type: Article

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