Investigation of via -dominated multi-modal electromigration failure distributions in dual damascene Cu interconnects with a discussion of the statistical implications

Annual Proceedings - Reliability Physics (Symposium)

Volumn , Issue , 2002, Pages 298-304

  Gill, Jason ^a   Sullivan, Tim ^a   Yankee, Sally ^a   Barth, Hans ^a   Von Glasow, Alex ^a  

^a IBM MICROELECTRONICS   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; FAILURE ANALYSIS; METALLIZING; MONTE CARLO METHODS; STRESS ANALYSIS;

DUAL DAMASCENE COPPER INTERCONNECTS;

ELECTROMIGRATION;

EID: 0036089114     PISSN: 00999512     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (5)

1. Experimental data and statistical models for bimodal EM failures
2. Scaling effects on electromigration in on-chip copper wiring
3. Mechanisms for very long electromigration lifetime in dual-damascene Cu interconnections
4. Deep consoring method for early reliability assessment