Delamination of thin films from two-dimensional interface flaws at corners and edges

International Journal of Fracture

Volumn 112, Issue 3, 2001, Pages 205-222

  Begley, Matthew R ^a   Ambrico, Joseph M ^b  

^a UNIVERSITY OF VIRGINIA   (United States)

^b UNIVERSITY OF CONNECTICUT   (United States)

Author keywords

Delamination; Mixed mode; Semi circular flaws; Thin films

Indexed keywords

CRACKS; DEFECTS; DELAMINATION; MATHEMATICAL MODELS; STRESS ANALYSIS; STRESS INTENSITY FACTORS; THERMAL EXPANSION; THIN FILMS;

SEMI-CIRCULAR INTERFACE FLAWS;

FRACTURE MECHANICS;

CRACK; DELAMINATION; FILM;

EID: 0035703961     PISSN: 03769429     EISSN: None     Source Type: Journal    
DOI: 10.1023/A:1013523927893     Document Type: Article

References (17)

1. Three-dimensional surface singularity of an interface crack
2. Surface singularity and crack propagation
3. State of stress at the vertex of a quarter-infinite crack in an elastic half-space
4. Three-dimensional fracture analysis of thin film debonding
5. The edge cracking and decohesion of thin films
6. Corner singularities of three-dimensional plane interface cracks
7. The influence of imperfections on the nucleation and propagation of buckling driven delaminations
8. Mixed mode cracking in layered materials
9. Decohesion of a cut pre-stressed film on a substrate
10. Three-dimensional effects in interfacial crack propagation
11. Three-dimensional stress fields of elastic interface cracks
12. Three-dimensional effects in thin film fracture mechanics
13. Antisymmetrical 3-D stress field near the crack front of a thin elastic plate
14. Elastic fracture mechanics concepts for interfacial cracks
15. Surface rumpling of a (Ni,Pt)Al bond coat induced by cyclic oxidation
16. Edge effects in thin film delamination