SCOPUS 정보 검색 플랫폼

Volumn 42, Issue 9-11, 2002, Pages 1415-1420

Fast temperature cycling and electromigration induced thin film cracking in multilevel interconnection: Experiments and modeling

(8) Nguyen, H V a Salm, C a Vroemen, J b Voets, J b Krabbenborg, B b Bisschop, J b Mouthaan, A J a Kuper, F G a,b

a UNIVERSITY OF TWENTE (Netherlands)

b NXP SEMICONDUCTORS (Netherlands)

Author keywords

[No Author keywords available]

Indexed keywords

CRACKS; DIELECTRIC MATERIALS; ELECTROMIGRATION; METAL EXTRUSION; SOLDERED JOINTS; THIN FILMS; WEIBULL DISTRIBUTION;

COFFIN-MANSON EQUATION; ELECTROMIGRATION FAILURES; INTER-LAYER DIELECTRICS; LOG-NORMAL DISTRIBUTION; MULTILEVEL INTERCONNECTION; TEMPERATURE CYCLING; TEMPERATURE CYCLING TESTS; THIN FILM CRACKING;

FAILURE (MECHANICAL);

EID: 0141942912 PISSN: 00262714 EISSN: None Source Type: Journal
DOI: 10.1016/S0026-2714(02)00161-0 Document Type: Conference Paper

Times cited : (22)

References (13)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.