Surface damage accumulation in Sn-Ag solder joints under large reversed strains

Journal of Materials Science: Materials in Electronics

Volumn 13, Issue 6, 2002, Pages 335-344

  Howell, J ^a   Telang, A ^a   Lee, J G ^a   Choi, S ^a   Subramanian, K N ^a  

^a Michigan State University   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTATIONAL GEOMETRY; EUTECTICS; FATIGUE OF MATERIALS; MICROSTRUCTURE; STRAIN; STRESS ANALYSIS; STRESS RELAXATION; SURFACE PHENOMENA; TIN ALLOYS;

REVERSED STRAIN;

SOLDERED JOINTS;

EID: 0036607612     PISSN: 09574522     EISSN: None     Source Type: Journal    
DOI: 10.1023/A:1015644330810     Document Type: Article

References (12)