Damage accumulation under repeated reverse stressing of Sn-Ag solder joints

Journal of Electronic Materials

Volumn 31, Issue 11, 2002, Pages 1181-1189

  Chen, K C ^a   Telang, A ^b   Lee, J G ^b   Subramanian, K N ^b  

^a CALIFORNIA POLYTECHNIC STATE UNIVERSITY   (United States)

^b Michigan State University   (United States)

Author keywords

Sn Ag; Solder joints; Stress strain behavior

Indexed keywords

DEFECTS; FATIGUE OF MATERIALS; METALLOGRAPHIC MICROSTRUCTURE; SHEAR STRESS; STRAIN; TIN; TIN ALLOYS;

DAMAGE ACCUMULATION; REVERSE STRESSING; SHEAR BANDING; STRESS-STRAIN BEHAVIOR; THERMOMECHANICAL FATIGUE; TIN DENDRITES; TIN-SILVER ALLOY;

SOLDERED JOINTS;

EID: 0036865862     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-002-0008-8     Document Type: Article

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