Reliability of flip chip applications with ceramic and organic chip carriers

Microelectronics Reliability

Volumn 42, Issue 9-11, 2002, Pages 1541-1546

  Di Giacomo, Giulio ^a   Oggioni, Stefano ^b  

^a IBM   (United States)

^b IBM   (Italy)

Author keywords

[No Author keywords available]

Indexed keywords

ACTIVATION ENERGY; CERAMIC MATERIALS; CHIP SCALE PACKAGES; CREEP; ELECTROMIGRATION; FAILURE (MECHANICAL); FATIGUE OF MATERIALS; RELIABILITY; SHEAR FLOW; SHEAR STRAIN; SOLDERED JOINTS;

CYCLE FREQUENCIES; FLIP CHIP APPLICATIONS; FLIP CHIP SOLDER JOINTS; PACKAGE MATERIALS; PACKAGE PROPERTIES; RELIABILITY MODEL; STRAIN AND FREQUENCY; THERMO MECHANICAL FATIGUES (TMF);

FLIP CHIP DEVICES;

EID: 0242264134     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/s0026-2714(02)00186-5     Document Type: Conference Paper

References (11)

1. L. F. Coffin, A Study of the Effect of Cyclic Thermal Stresses on a Ductile Metal, Trans. ASME, Vol. 76, pp. 931-950, 1954.
2. L. F. Coffin, Symposium on Internal Stresses and Fatigue of Metals, Elsevier Publishing Co. (1959)
3. S. S. Manson, Fatigue: A complex Subject-Some simple Approximations, Experimental Mech., Vol 5, No.7, pp. 193-226, 1965.
4. K.C. Norris and A. H. Landzberg, IBM J. Res. Devel., May 1969.
5. G. Di Giacomo and Li Li, Generic Fatigue Model for C4, CBGA, CCGA, andPBGA, 1999 International Sytem Packaging Symposium (IMAPS), Jan. 11-13, 1999.
6. nd -Level Interconnects with and without Chip Underfill, High Density Packaging and MCMs: Denver '99, April 7-9, 1999.
7. G. Di Giacomo, Effect of Mini-Cycles on the Solder Joint Fatigue Behavior as a Result of Their Superimposition on Main Cycles, 1996 Proc. International Symposium on Microelectronics, pp. 302-307, 1996.
8. G Di Giacomo, Modeling the Effect of Oxygen on the Fatigue Lifetime of Solder Joints, 1995 IEEE International Reliability Physics Proceedings, pp. 93-96, 1995.
9. G. Di Giacomo, Thermal Diffusion Model Describing Transient Strain in Chip Solder-Joints Under Thermal Cycling, 1992 Proceedings International Symposium on Microelectronics, pp.637-642, 1992.
10. G. Di Giacomo and J. Jaspal, Reliability of Die-Level Interconnections, Area Array Technology Handbook, Ed. K. Puttlitz and P. Totta, Kluwer Publishing, 2001.
11. A. J. Kennedy, Process of Creep and Fatigue in Metals, John Wiley & Sons, Inc., 1963, pp. 346-351.