Mechanical characterization of Sn-3.5Ag solder joints at various temperatures

Soldering & Surface Mount Technology

Volumn 15, Issue 3, 2003, Pages 21-26

  Rhee, H ^a   Subramanian, K N ^a   Lee, A ^a   Lee, J G ^a  

^a Michigan State University   (United States)

Author keywords

Deformation; Fatigue; Joining processes; Mechanical properties of materials; Soldering

Indexed keywords

EID: 84986052291     PISSN: 09540911     EISSN: None     Source Type: Journal    
DOI: 10.1108/09540910310505080     Document Type: Article

References (26)

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