Electrical conductivity changes in bulk Sn, and eutectic Sn-Ag in bulk and in joints, from aging and thermal shock

Journal of Materials Research

Volumn 20, Issue 2, 2005, Pages 364-374

  Guo, F ^a   Lee, J G ^a   Hogan, T ^a   Subramanian, K N ^a  

^a Michigan State University   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

AGING OF MATERIALS; DETERIORATION; ELECTRIC CONDUCTIVITY MEASUREMENT; ELECTRIC CONDUCTIVITY OF SOLIDS; ENERGY DISPERSIVE SPECTROSCOPY; EUTECTICS; HEAT TREATMENT; INTERMETALLICS; SCANNING ELECTRON MICROSCOPY; SOLDERING ALLOYS; THERMAL EFFECTS; THERMAL EXPANSION;

ELECTRONIC INTERCONNECTS; ISOTHERMAL AGING; THERMAL SHOCK TREATMENT;

TIN ALLOYS;

EID: 27144558671     PISSN: 08842914     EISSN: None     Source Type: Journal    
DOI: 10.1557/JMR.2005.0064     Document Type: Article

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