Effects of internal stresses on the thermomechanical behavior of Sn-based solder joints

Materials Science and Engineering: A

Volumn 421, Issue 1-2, 2006, Pages 46-56

  Subramanian, K N ^a   Lee, J G ^a  

^a Michigan State University   (United States)

Author keywords

Internal stress; Sn based solders; Solder joints; TMF

Indexed keywords

ANISOTROPY; GRAIN BOUNDARIES; REINFORCEMENT; RESIDUAL STRESSES; THERMAL EFFECTS; THERMAL EXPANSION; TIN;

SUBMICRON SIZE STABLE REINFORCEMENTS; TEMPERATURE EXCURSION; THERMOMECHANICAL BEHAVIOR;

SOLDERED JOINTS;

ANISOTROPY; GRAIN BOUNDARIES; REINFORCEMENT; RESIDUAL STRESSES; SOLDERED JOINTS; THERMAL EFFECTS; THERMAL EXPANSION; TIN;

EID: 33645921645     PISSN: 09215093     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.msea.2005.10.005     Document Type: Article

References (30)

1. Smith E.B., and Swanger L.K. Trans. Inst. Met. Finish. 78 Part 2 (2000) B12-B21
2. Miric A.Z., and Grusd A. Solder. Surf. Mount Technol. 10 1 (1998) 19
3. Winterbottom W.L. JOM 45 (1993) 20
4. Jordan M. Trans. Inst. Met. Finish. 75 4 (1997) 49-153
5. Anderson I.E., and Harringa J.L. J. Electron. Mater. 33 12 (2004) 1485-1496
6. Cavasin D., and Zheng R. TMS Lett. 1 8 (2004) 163-164
7. Kairya Y., Asai T., Suga T., and Otsuka M. TMS Lett. 1 8 (2004) 169-170
8. Dutta I., Gopinath A., and Marshall C. J. Electron. Mater. 31 4 (2002) 253-264
9. Clech J.P., Manock J.C., Noctor D.M., Bader F.E., and Augis J.A. IEEE Trans. Comp. Hybrids Manuf. Technol. 16 8 (1993) 949-960
10. Ding Y., Wang C.Q., and Tian Y.H. Acta Metall. Sinica 39 8 (2003) 879-884
11. Zhang L.J., Wang L., Xie X.M., and Kempe W. IEEE Trans. Electron. Packaging Manuf. 25 4 (2002) 284-288
12. Lu H., Hung K.C., Stoyanov S., Bailey C., and Chan Y.C. Microelectron. Reliability 42 8 (2002) 1205-1212
13. Shohji I., Mori H., and Orii Y. Microelectron. Reliability 44 2 (2004) 269-274
14. Pahl B., Kallmayer C., Aschenbrenner R., and Reichl H. Microelectron. Reliability 44 2 (2004) 309-314
15. Lee J.G., Telang A., Subramanian K.N., and Bieler T.R. J. Electron. Mater. 31 11 (2002) 1152-1159
16. J.G. Lee, F. Guo, K.N. Subramanian, SAE 2003 World Congress, 3-6 March, Detroit, MI, 2003 (SAE Paper Number 2003-01-0621).
17. Subramanian K.N., and Lee J.G. J. Mater. Sci. Mater. Electron. 15 (2004) 235-240
18. Lee T.Y., Choi W.J., Tu K.N., Jang J.W., Kuo S.M., Lin J.K., Frear D.R., Zeng K., and Kivilahti J.K. J. Mater. Res. 17 2 (2002) 291-301
19. Hu Y.C., Lin Y.H., Kao C.R., and Tu K.N. J. Mater. Res. 18 11 (2003) 2544-2548
20. Nah J.W., Paik K.W., Suh J.O., and Tu K.N. J. Appl. Phys. 94 12 (2003) 7560-7566
21. McDougall J., Choi S., Bieler T.R., Subramanian K.N., and Lucas J.P. Mater. Sci. Eng. A 285 (2000) 25-34
22. Frear D.R., Morgan H., Bruchett S., and Lau J. The Mechanics of Solder Alloy Interconnects (1994), Van Nostrand Reinhold, New York, NY pp. 60-61
23. Barrett C.S. In: Mehl R.F. (Ed). Metallurgy and Metallurgical Engineering Series. second ed. (1952) 337-379
24. Choi S., Lucas J.P., Bieler T.R., and Subramanian K.N. J. Electron. Mater. 29 10 (2000) 1249-1257
25. Guo F., Lee J.G., Hogan T., and Subramanian K.N. J. Mater. Res. 20 2 (2005) 364-375
26. J.G. Lee, K.N. Subramanian, Microelectron. Reliability, in press.
27. Rhee H., and Subramanian K.N. J. Electron. Mater. 32 11 (2003) 1310-1316
28. Lee J.G., and Subrmanian K.N. J. Electron. Mater. 32 6 (2003) 523-530
29. Smith W.F. Structure and Properties of Engineering Alloys. second ed. (1993), McGraw-Hill, New York, NY pp. 498-509
30. Lee J.G., and Subramanian K.N. Solder. Surf. Mount Technol. 17 1 (2005) 33-39