A parametric approach for assessment of thermomechanical fatigue performance of Sn-based solder joints

Journal of Electronic Materials

Volumn 34, Issue 10, 2005, Pages 1313-1317

  Subramanian, K N ^a  

^a Michigan State University   (United States)

Author keywords

Electronic solders; Lead free solders; Thermomechanical fatigue

Indexed keywords

FATIGUE OF MATERIALS; THERMOMECHANICAL TREATMENT;

ELECTRONIC SOLDER; LEAD-FREE SOLDERS; THERMOMECHANICAL FATIGUE;

SOLDERED JOINTS;

FATIGUE; JOINTS; SOLDERING;

EID: 27144467761     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-005-0256-5     Document Type: Article

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