Roles of imposed cyclic strain amplitude and cyclic strain rate on the stress relaxation behaviour of pre-strained eutectic Sn-3.5Ag solder joints

Soldering and Surface Mount Technology

Volumn 18, Issue 1, 2006, Pages 19-28

  Rhee, H ^a   Subramanian, K N ^a  

^a Michigan State University   (United States)

Author keywords

Cyclic loading; Soldering; Strain measurement; Stress

Indexed keywords

CYCLIC LOADS; EUTECTICS; SILVER; STRAIN MEASUREMENT; STRAIN RATE; STRESS RELAXATION; TIN;

CYCLIC SHEAR STRAINING; SHEAR STRAIN;

SOLDERED JOINTS;

EID: 33644514329     PISSN: 09540911     EISSN: None     Source Type: Journal    
DOI: 10.1108/09540910610647080     Document Type: Article

References (23)

1. Abtew, M. and Selvaduray, G. (2000), "Lead-free solders in microelectronics", Materials Science & Engineering, Vol. 27, pp. 95-141.
2. Arrowood, R. and Mukherjee, A.K. (1987), "Stress relaxation of a eutectic alloy in the superplastic condition", Materials Science & Engineering, Vol. 92, pp. 33-41.
3. Baker, E. (1979), "Stress relaxation in tin-lead solders", Materials Science & Engineering, Vol. 38, pp. 241-7.
4. Choi, S., Lee, J.G., Guo, F., Bieler, T.R., Subramanian, K.N. and Lucas, J.P. (2001), "Creep properties of Sn-Ag solder joints containing intermetallic particles", The Member Journal of the Minerals, Metals and Materials Society, Vol. 53 No. 6, pp. 22-6.
5. Courtney, T.H. (1990), Mechanical Behavior of Materials, McGraw-Hill, New York, NY.
6. Frear, D.R. (1989), "Thermomechanical fatigue of solder joints: a new comprehensive test method", IEEE Transactions on Components, Hybrids, and Manufacturing Technology, Vol. 12 No. 4, pp. 492-501.
7. Frost, H.J. and Howard, R.T. (1990), "Creep fatigue modeling for solder joint reliability predictions including the microstructural evolution of the solder", IEEE Transactions on Components, Hybrids, and Manufacturing Technology, Vol. 13 No. 4, pp. 727-35.
8. Gunawan, M., Wong, E.H., Mhaisalkar, S.G., Davila, L.T., Hong, Y., Caers, J.F.J.M. and Tsai, T.K. (2004), "Characterization and modeling of static and cyclic relaxation in nonconductive adhesives", Journal of Electronic Materials, Vol. 33 No. 9, pp. 1041-7.
9. Hare, E.W. and Stang, R.G. (1995), "Stress relaxation behavior of eutectic tin-lead solder", Journal of Electronic Materials, Vol. 24 No. 10, pp. 1473-84.
10. Jadhav, S.G., Bieler, T.R., Subramanian, K.N. and Lucas, J.P. (2001), "Stress relaxation behavior of composite and eutectic Sn-Ag solder joints", Journal of Electronic Materials, Vol. 30 No. 9, pp. 1197-205.
11. Kanchanomai, C. and Mutoh, Y. (2004), "Low-cycle fatigue prediction model for Pb-free solder 96.5Sn-3.5Ag", Journal of Electronic Materials, Vol. 33 No. 4, pp. 329-33.
12. Mavoori, H., Chin, J., Vaynman, S., Moran, B., Keer, L. and Fine, M. (1997), "Creep, stress relaxation, and plastic deformation in Sn-Ag and Sn-Zn eutectic solders", Journal of Electronic Materials, Vol. 26 No. 7, pp. 783-90.
13. Meyers, M.A. and Chawla, K.K. (1984), Mechanical Metallurgy - Principles and Applications, Prentice-Hall, Englewood Cliffs, NJ.
14. Miller, D.A. and Priest, R.H. (1987), "Materials response to thermal-mechanical strain cycling", in Skelton, R.P. (Ed.), High Temperature Fatigue: Properties and Prediction, Elsevier Science Publishing Co., Inc., New York, NY, pp. 113-75.
15. Pao, Y.H., Badgley, S., Jih, E., Govila, R. and Browning, J. (1993), "Constitutive behavior and low cycle thermal fatigue of 97Sn-3Cu solder joints", Journal of Electronic Packaging, Vol. 115, pp. 147-52.
16. Rhee, H. and Subramanian, K.N. (2003), "Effects of pre-strain, rate of pre-strain, and temperature on the stress relaxation behavior of eutectic Sn-3.5Ag solder joints", Journal of Electronic Materials, Vol. 32 No. 11, pp. 1310-6.
17. Rhee, H., Subramanian, K.N., Lee, A. and Lee, J.G. (2003), "Mechanical characterization of Sn-3.5Ag solder joints at various temperatures", Soldering and Surface Mount Technology, Vol. 15 No. 3, pp. 21-6.
18. Rhee, H., Subramanian, K.N. and Lee, A. (2004), "Role of imposed cyclic straining on the stress relaxation behavior of eutectic Sn-3.5Ag solder joints", Journal of Materials Science: Materials in Electronics.
19. Sandor, B.I. (1978), Strength of Materials, Prentice-Hall, Englewood Cliffs, NJ.
20. Skelton, R.P. (1987), "Cyclic stress-strain properties during high strain fatigue", in Skelton, R.P. (Ed.), High Temperature Fatigue: Properties and Prediction, Elsevier Science Publishing Co., Inc., New York, NY, pp. 27-112.
21. Solomon, H.D. (1991), "Low cycle fatigue of Sn96 solder with reference to eutectic solder and a high Pb solder", Journal of Electronic Packaging, Vol. 113, pp. 102-8.
22. Wild, R.N. (1972), "Fatigue properties of solder joints", Welding Journal, Vol. 51 No. 11, pp. s521-6.
23. Woodmansee, M.W. and Neu, R.W. (2002), "The influence of prior strain rate on stress relaxation in solder alloys", Materials Science & Engineering A, Vol. 322, pp. 79-88.