Partially-constrained thermomechanical fatigue of eutectic tin-bismuth/copper solder joints

Journal of Electronic Materials

Volumn 28, Issue 9, 1999, Pages 1045-1054

  Raeder, C H ^a,b   Messler Jr , R W ^a   Coffin Jr , L F ^a  

^a RENSSELAER POLYTECHNIC INSTITUTE   (United States)

^b ADVANCED MICRO DEVICES   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER; EUTECTICS; FATIGUE OF MATERIALS; PLASTICITY; SHEAR STRESS; SOLDERED JOINTS; STRAIN MEASUREMENT; THERMOMECHANICAL TREATMENT; TIN ALLOYS;

PARTIALLY-COMPLIANT JOINTS; PARTIALLY-CONSTRAINED THERMOMECHANICAL FATIGUE;

ELECTRONICS PACKAGING;

EID: 0033362597     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-999-0182-z     Document Type: Article

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