Microbridge testing of silicon nitride thin films deposited on silicon wafers

Acta Materialia

Volumn 48, Issue 11, 2000, Pages 2843-2857

  Zhang, T Y ^a   Su, Y J ^a   Qian, C F ^a   Zhao, M H ^a   Chen, L Q ^a  

^a HONG KONG UNIVERSITY OF SCIENCE AND TECHNOLOGY   (Hong Kong)

Author keywords

[No Author keywords available]

Indexed keywords

ANNEALING; BENDING STRENGTH; CHEMICAL VAPOR DEPOSITION; DEFORMATION; ELASTIC MODULI; FINITE ELEMENT METHOD; RESIDUAL STRESSES; SILICON NITRIDE; SILICON WAFERS; STRAIN MEASUREMENT; STRESS ANALYSIS;

LOAD DEFLECTION CURVES; MICROBRIDGE TESTING; MICROELECTROMECHANICAL FABRICATION TECHNIQUE;

THIN FILMS;

EID: 0033719568     PISSN: 13596454     EISSN: None     Source Type: Journal    
DOI: 10.1016/S1359-6454(00)00088-4     Document Type: Article

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