In situ tensile strength measurement and Weibull analysis of thick film and thin film micromachined polysilicon structures

Thin Solid Films

Volumn 292, Issue 1-2, 1997, Pages 247-254

  Greek, Staffan ^a   Ericson, Fredric ^a   Johansson, Stefan ^a   Schweitz, Jan Åke ^a  

^a UPPSALA UNIVERSITY   (Sweden)

Author keywords

Silicon; Stress

Indexed keywords

ATOMIC FORCE MICROSCOPY; BEAMS AND GIRDERS; CALCULATIONS; FRACTURE TOUGHNESS; MANIPULATORS; SCANNING ELECTRON MICROSCOPY; TENSILE STRENGTH; TENSILE TESTING; THICK FILMS; THIN FILMS; TRANSMISSION ELECTRON MICROSCOPY; WEIBULL DISTRIBUTION;

MICROMACHINED STRUCTURES; MICROMANIPULATOR; POLYSILICON;

SILICON;

EID: 0031553481     PISSN: 00406090     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0040-6090(96)09076-1     Document Type: Article

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