Application of volatility diagrams for low temperature, dry etching, and planarization of copper

Journal of the Electrochemical Society

Volumn 149, Issue 11, 2002, Pages

  Kulkarni, Nagraj S ^a   DeHoff, Robert T ^a  

^a UNIVERSITY OF FLORIDA   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINUM; CHLORINE; COPPER COMPOUNDS; DRY ETCHING; HYDROGEN; LOW TEMPERATURE OPERATIONS; PARTIAL PRESSURE; PHASE DIAGRAMS; REACTIVE ION ETCHING; THERMOANALYSIS; THERMODYNAMIC PROPERTIES;

CHEMICAL MECHANICAL PLANARIZATION; COPPER CHLORIDE; DAMASCENCE; PLANARIZATION; REACTIVE ION PLANARIZATION; THERMODYNAMIC ANALYSIS; VOLATILITY;

COPPER;

EID: 0036863942     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.1513986     Document Type: Article

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