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Volumn 23, Issue 12, 2000, Pages
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Assessing the environmental impact of copper CMP
a,b,c,d a,e,f,g a,h |
Author keywords
[No Author keywords available]
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Indexed keywords
CHEMICAL MECHANICAL POLISHING;
COPPER HYDROXIDE;
COPPER INTERCONNECT TECHNOLOGY;
CUPRIC ION;
ULTRAPURE WATER;
AGENTS;
CHEMICAL POLISHING;
CHEMICALS REMOVAL (WATER TREATMENT);
COMPLEXATION;
COPPER OXIDES;
EFFLUENTS;
ENVIRONMENTAL IMPACT;
POSITIVE IONS;
PRECIPITATION (CHEMICAL);
WASTEWATER DISPOSAL;
WATER;
SEMICONDUCTOR DEVICE MANUFACTURE;
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EID: 6744248636
PISSN: 01633767
EISSN: None
Source Type: Journal
DOI: None Document Type: Article |
Times cited : (13)
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References (11)
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