Copper LPCVD for advanced technology

Microelectronic Engineering

Volumn 33, Issue 1-4, 1997, Pages 25-30

  Bourhila, N ^a   Torres, J ^b   Palleau, J ^b   Bernard, C ^c   Madar, R ^a  

^a CNRS   (France)

^b ORANGE LABS   (France)

^c UNIV GRENOBLE ALPES   (France)

Author keywords

[No Author keywords available]

Indexed keywords

ASPECT RATIO; CHEMICAL VAPOR DEPOSITION; CHLORINATION; COPPER; METALLIC FILMS; MORPHOLOGY; PRESSURE EFFECTS; SUBSTRATES; THIN FILMS;

SOFTWARE PACKAGE MELANGE;

MICROELECTRONIC PROCESSING;

EID: 0012062252     PISSN: 01679317     EISSN: None     Source Type: Journal    
DOI: 10.1016/s0167-9317(96)00027-5     Document Type: Article

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