Planarization of copper damascene interconnects by spin-etch process: A chemical approach

Materials Research Society Symposium - Proceedings

Volumn 613, Issue , 2000, Pages

  Mukherjee, S P ^a   Levert, J A ^a   DeBear, D S ^a  

^a HONEYWELL   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ABRASION; CHEMICAL MECHANICAL POLISHING; ELECTROCHEMISTRY; ELECTROLYTIC POLISHING; ETCHING; PROCESS CONTROL; REMOVAL; SURFACE TOPOGRAPHY;

ABRASIVE FREE ETCHANTS; COPPER DAMASCENE; PLANARIZATION; SPIN ETCH PROCESS;

COPPER;

EID: 0034433351     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (7)