Novel plasma-based copper dry etching method

Japanese Journal of Applied Physics, Part 2: Letters

Volumn 39, Issue 3 A/B, 2000, Pages

  Kuo, Yue ^a   Lee, Sangheon ^a  

^a Texas AandM University   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER COMPOUNDS; GROWTH (MATERIALS); HYDROCHLORIC ACID; INTEGRATED CIRCUITS; MICROELECTRONICS; OPTOELECTRONIC DEVICES; PHYSICAL PROPERTIES; PLASMA ETCHING; REACTION KINETICS; SWELLING;

COPPER CHLORIDE; COPPER DRY ETCHING; COPPER SWELLING; PLASMA COPPER REACTION;

COPPER;

EID: 0033731387     PISSN: 00214922     EISSN: None     Source Type: Journal    
DOI: 10.1143/jjap.39.l188     Document Type: Article

References (11)

1. National Technology Roadmap for Semiconductors (NTRS), Table 31 Interconnect Difficult Challenges, Five Difficult Challenges < 100 nm/Beyond 2006, Semiconductor Industry Association (SIA) 1997.
2. H. Miyazaki, K. Takeda, N. Sakuma, S. Kondo, Y. Homma and H. Hinode: J. Vac. Sci. & Technol. B 15 (1997) 237.
3. J. W. Lee, Y. D. Park, J. R. Childress, S. J. Pearton, F. Sharifi and F. Ren: J. Electrochem. Soc. 145 (1998) 2585.
4. Y. Ohshita and N. Hosoi: Thin Solid Films 262 (1995) 67.
5. G. C. Schwartz and P. M. Schaible: J. Electrochem. Soc. 130 (1983) 1777.
6. B. J. Howard and C. H. Steinbruchel: Appl. Phys. Lett. 59 (1991) 914.
7. M. Markert, A. Bertz and T. Gessner: Microelectron. Eng. 35 (1997) 333.
8. Y. Kuo: Jpn. J. Appl. Phys. 32 (1993) L126.
9. M. S. Kwon and J. Y. Lee: J. Electrochem. Soc. 146 (1999) 3119.
10. W. Sessselmann and T. J. Chung: Surf. Sci. 176 (1986) 32.
11. R. Perry and C. H. Chilton: Chemical Engineers' Handbook (McGraw-Hill, New York, 1973) 5th ed., pp. 3-93.