Advanced processing: CMP of Cu/low-k and Cu/ultralow-k layers

Solid State Technology

Volumn 44, Issue 9 SUPPL., 2001, Pages

  Wang, S ^a   Grover, G ^a   Baker, C ^a   Chamberlain, J ^a   Yu, C ^a  

^a Cobot Microelectronics Corp ^*  (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION; CHEMICAL MECHANICAL POLISHING; COPPER; DELAMINATION; INTEGRATED CIRCUIT MANUFACTURE; PERMITTIVITY; PHASE TRANSITIONS; STRENGTH OF MATERIALS; THERMAL CONDUCTIVITY;

CHEMICAL COMPATIBILITY; MECHANICAL COMPATIBILITY; MECHANICAL STABILITY; SEAMLESS TRANSITION;

DIELECTRIC MATERIALS;

EID: 17744409374     PISSN: 0038111X     EISSN: None     Source Type: Trade Journal    
DOI: None     Document Type: Article

References (7)

1. Cu corrosion mechanisms and control
2. Enabling planarization for the twenty-first century: Opportunities, challenges, and alternatives